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10
YRS
Guangzhou Minder-Hightech Co., Ltd.
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Wire Bonders
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Fully Automatic Die bonder Die bonding machine suitable for Multi Chip Replaceable Suction Nozzle
$185,000.00
(Min. Order) 1 piece
Semiconductor Silicon wafer Planarization High precision Chemical Mechanical Planarization CMP process
$180,000.00
(Min. Order) 1 piece
Semiconductor Flattening Wafer Surface Fab Removing Wafer Residue Chemical Mechanical Planarization CMP process
$180,000.00
(Min. Order) 1 piece
Semiconductor Thinning Polishing High precision Chemical Polisher Equipment Wafer Surface Chemical Mechanical Planarization CMP
$180,000.00
(Min. Order) 1 piece
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